Oh yeah, the interface definitely leaves a lot to be desired. It's almost like it's getting PC104-legacy-ish at this point. On the other hand, the high density interconnects (even the ones way back from when Motorola and Apple started to make PowerPC daughter boards) are a PITA to work with when you need to do anything except one-off assembly...
Perhaps some form factor with a required low-density power + slow data interface and an optional high-density high-speed data interface would be the sweet spot. But if even something like M.2 standardisation tells us anything, even that is going to be a mess.
I guess we're stuck with foil tape for the time being.
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Oh yeah, the interface definitely leaves a lot to be desired. It's almost like it's getting PC104-legacy-ish at this point. On the other hand, the high density interconnects (even the ones way back from when Motorola and Apple started to make PowerPC daughter boards) are a PITA to work with when you need to do anything except one-off assembly...
Perhaps some form factor with a required low-density power + slow data interface and an optional high-density high-speed data interface would be the sweet spot. But if even something like M.2 standardisation tells us anything, even that is going to be a mess.
I guess we're stuck with foil tape for the time being.