I've been using Toradex as well lately because of the pin compatibility. Apalis and Colibri are pretty solid products. Kind of makes me wish the SOM standardization movement hadn't fizzled out because that might have made some of the supply issues less problematic. Or maybe not.
Also, the SODIMM connector is long in the tooth and gives off a shitton of RF radiation especially when you're driving an LCD over the rails. But the alternatives like the Hirose mezz connectors aren't optimal either.
NXP/Freescale's kernel isn't the greatest but at least they try to get close to mainline. TI gets a thumbs up as well.
Oh yeah, the interface definitely leaves a lot to be desired. It's almost like it's getting PC104-legacy-ish at this point. On the other hand, the high density interconnects (even the ones way back from when Motorola and Apple started to make PowerPC daughter boards) are a PITA to work with when you need to do anything except one-off assembly...
Perhaps some form factor with a required low-density power + slow data interface and an optional high-density high-speed data interface would be the sweet spot. But if even something like M.2 standardisation tells us anything, even that is going to be a mess.
I guess we're stuck with foil tape for the time being.
Comments
I've been using Toradex as well lately because of the pin compatibility. Apalis and Colibri are pretty solid products. Kind of makes me wish the SOM standardization movement hadn't fizzled out because that might have made some of the supply issues less problematic. Or maybe not.
Also, the SODIMM connector is long in the tooth and gives off a shitton of RF radiation especially when you're driving an LCD over the rails. But the alternatives like the Hirose mezz connectors aren't optimal either.
NXP/Freescale's kernel isn't the greatest but at least they try to get close to mainline. TI gets a thumbs up as well.
Oh yeah, the interface definitely leaves a lot to be desired. It's almost like it's getting PC104-legacy-ish at this point. On the other hand, the high density interconnects (even the ones way back from when Motorola and Apple started to make PowerPC daughter boards) are a PITA to work with when you need to do anything except one-off assembly...
Perhaps some form factor with a required low-density power + slow data interface and an optional high-density high-speed data interface would be the sweet spot. But if even something like M.2 standardisation tells us anything, even that is going to be a mess.
I guess we're stuck with foil tape for the time being.