All things you mention combined only explain a factor up to 4 (probably much less since the complexity increases). With a factor of 2-3 already being realized years ago.
Yup & the most recent flash memory consumer price drops are due to a process shrink plus 3D die stacking, rather than just MLC/TLC.
Stacking can and will be used for DRAM as well but 3D DRAM-based products have not hit high-vol consumer markets yet, so it's currently widening the cost-per-bit gap b/t DRAM & NAND.
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All things you mention combined only explain a factor up to 4 (probably much less since the complexity increases). With a factor of 2-3 already being realized years ago.
Yup & the most recent flash memory consumer price drops are due to a process shrink plus 3D die stacking, rather than just MLC/TLC.
Stacking can and will be used for DRAM as well but 3D DRAM-based products have not hit high-vol consumer markets yet, so it's currently widening the cost-per-bit gap b/t DRAM & NAND.