BTW, the ARM cell phone SOC I worked with everyday has integrated GPU, video processor (HW base), 2,4,6,8 ARM Cores, with integrated CP (Cellular processor), almost all the necessary IO such as USB (OTG, 3.0), SD, Display controller etc are all integrated inside the SOC.
DDR are POP soldered on top of SOC directly - similar to raspberry pie's SOC's RAM.
The power are way lower.
All package (With DDR) in size of the thumbnail. A PCB with SOC + EMMC (Flash) + PMIC + Wifi is size of the postage stamp.
And they are selling billions of them every year.
It is amaze how far ahead of for ARM SOC as compare to x86 camp. (In my point of view.)
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BTW, the ARM cell phone SOC I worked with everyday has integrated GPU, video processor (HW base), 2,4,6,8 ARM Cores, with integrated CP (Cellular processor), almost all the necessary IO such as USB (OTG, 3.0), SD, Display controller etc are all integrated inside the SOC.
DDR are POP soldered on top of SOC directly - similar to raspberry pie's SOC's RAM.
The power are way lower.
All package (With DDR) in size of the thumbnail. A PCB with SOC + EMMC (Flash) + PMIC + Wifi is size of the postage stamp.
And they are selling billions of them every year.
It is amaze how far ahead of for ARM SOC as compare to x86 camp. (In my point of view.)
In more ways than TDP.