Very quick, but I wonder how much of it comes from the clock speed bump (4.93 GHz from 4.26 GHz, +15.7%) instead of overall platform IPC improvements.
If it were largely clock speed, I worry we'll find that thermal throttling makes these numbers only generally available in the lab or very short bursts before the device gets too warm.
That said, very excited for what that means for the Neo laptops with more thermal headroom once they get a refresh, and if it happened to be this chip. Though I suppose that is unlikely, as they seem to be adopting a strategy of using past-gen chips for Neo.
"I wonder how much of it comes from the clock speed bump (4.93 GHz from 4.26 GHz, +15.7%)"
About 15.7%.
"If it were largely clock speed, I worry we'll find that thermal throttling makes these numbers only generally available in the lab"
Going from TSMC's 3nm N3P to 2nm N2 process reduces overall power consumption and thermal output by more than 15%. The reason they're able to boost the clock is because they have new headroom. It also increases the thermal density, which means the heat that's generated needs to be moved more quickly, which is probably why they also have new thermal management.
Comments
Very quick, but I wonder how much of it comes from the clock speed bump (4.93 GHz from 4.26 GHz, +15.7%) instead of overall platform IPC improvements.
If it were largely clock speed, I worry we'll find that thermal throttling makes these numbers only generally available in the lab or very short bursts before the device gets too warm.
That said, very excited for what that means for the Neo laptops with more thermal headroom once they get a refresh, and if it happened to be this chip. Though I suppose that is unlikely, as they seem to be adopting a strategy of using past-gen chips for Neo.
About 15.7%.
Going from TSMC's 3nm N3P to 2nm N2 process reduces overall power consumption and thermal output by more than 15%. The reason they're able to boost the clock is because they have new headroom. It also increases the thermal density, which means the heat that's generated needs to be moved more quickly, which is probably why they also have new thermal management.
I can imagine that the new vapour chamber they’re introducing helps or is necessary to run this chip at high speeds.