While TDP isn't the whole truth, a pretty solid rule of thumb is that a CPU will at most use about 2x TDP. That is still not that much here.
That said, GPUs look like they mostly vent to outside the case, but that is largely untrue. They mostly vent to the inside and that really heats up the case.
As someone who has a few top 10/100 overclocking records across various Zen configurations, you'd be very surprised what a couple C does for peak/sustained boost clocks.
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Modern AMD processors will make use of any thermal headroom they have to go faster (up until they hit power limits), it's very much worth the effort.
While TDP isn't the whole truth, a pretty solid rule of thumb is that a CPU will at most use about 2x TDP. That is still not that much here.
That said, GPUs look like they mostly vent to outside the case, but that is largely untrue. They mostly vent to the inside and that really heats up the case.
As someone who has a few top 10/100 overclocking records across various Zen configurations, you'd be very surprised what a couple C does for peak/sustained boost clocks.