That's fair, I was thinking of hole-through components and I should probably stop doing that in 2026... But: if we're being pedantic: it isn't the physical size as much as it is the loop area that the current travels through, and that doesn't depend so much on the size of the package as on how the package is constructed. Low ESR caps such as IDC or LGA type caps will do better than other types even if the physical size is identical. Lead length also still matters, whether physical leads or length of the traces connecting the cap to the device and these should be kept as short as possible.
Comments
That's fair, I was thinking of hole-through components and I should probably stop doing that in 2026... But: if we're being pedantic: it isn't the physical size as much as it is the loop area that the current travels through, and that doesn't depend so much on the size of the package as on how the package is constructed. Low ESR caps such as IDC or LGA type caps will do better than other types even if the physical size is identical. Lead length also still matters, whether physical leads or length of the traces connecting the cap to the device and these should be kept as short as possible.