So it sounded like the wafer was being used as an interconnect kind of thing that might be much easier to fab.

The actual processors sound like they’re being made on other wafers in a standard way and then cut out and attached to the interconnect wafer.

So it’s not like the entire part was built only on one wafer and a single mistake would cause the whole thing to have to be thrown out.

At least that’s how I understood the article + educated guessing.