I find this article to be quite frustrating. It's like reading about how some process was too slow, so they looked at the variables which include a faster processor, more RAM, and larger storage. Ultimately, they chose more RAM and developed a new algorithm and all was solved. But then they never tell you what the algorithm is. Or why it allowed them to keep within the constraints of the same processor and storage.
In this case, it's a new adhesive. But how was that developed? What makes the new adhesive better suited to high-pressure applications while keeping the temperature and time constant? Inquiring geeks want to know!
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I find this article to be quite frustrating. It's like reading about how some process was too slow, so they looked at the variables which include a faster processor, more RAM, and larger storage. Ultimately, they chose more RAM and developed a new algorithm and all was solved. But then they never tell you what the algorithm is. Or why it allowed them to keep within the constraints of the same processor and storage.
In this case, it's a new adhesive. But how was that developed? What makes the new adhesive better suited to high-pressure applications while keeping the temperature and time constant? Inquiring geeks want to know!