Comment on The future of computers: 3D chip stackingComments−tcas14yXilinx's Vertex 7 FPGA uses a stacked design for the interconnects. The FPGA logic is all 28nm, but sitting under it is a completely passive 65nm interconnect layer.http://www.xilinx.com/products/technology/stacked-silicon-in...
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Xilinx's Vertex 7 FPGA uses a stacked design for the interconnects. The FPGA logic is all 28nm, but sitting under it is a completely passive 65nm interconnect layer.
http://www.xilinx.com/products/technology/stacked-silicon-in...