Comment on The Economist on Intel versus ARMparentComments−Klinky14yWhat is wrong with that statement? Intel is using a new 3D Tri-Gate Transitor tech for 22nm & have plans for 14nm in the future.−wmf14yPretty much everyone outside Intel thinks FinFETs should not be called 3D, since 3D was already used to refer to die stacking.−sern14yNot to mention that chips are already 3D with multiple metal layers.−wisty14yIt makes it sound as though you need 3D to shrink the chips. I don't think that's the case. I don't like calling a 3D component a 3D chip design, either.
Comments
What is wrong with that statement? Intel is using a new 3D Tri-Gate Transitor tech for 22nm & have plans for 14nm in the future.
Pretty much everyone outside Intel thinks FinFETs should not be called 3D, since 3D was already used to refer to die stacking.
Not to mention that chips are already 3D with multiple metal layers.
It makes it sound as though you need 3D to shrink the chips. I don't think that's the case. I don't like calling a 3D component a 3D chip design, either.