Stacked silicon is a thing, DRAM is already stacked 32 or even 64 layers, but for logic chips even those are being stacked - HBM can be a memory die stacked on a logic die, and there are so called 3d-ICs which can stack either active on active or active on passive dies. The next step would be more than 2 dies stacked, but that will have some interesting heat dissipation challenges...
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Stacked silicon is a thing, DRAM is already stacked 32 or even 64 layers, but for logic chips even those are being stacked - HBM can be a memory die stacked on a logic die, and there are so called 3d-ICs which can stack either active on active or active on passive dies. The next step would be more than 2 dies stacked, but that will have some interesting heat dissipation challenges...