They sell the full article which is why they aren't naming it in the public article. I suspect what they're saying is that the company has invested so heavily in getting to tapeout on Intel that it's too late to move their design to TSMC. To do that they would basically have to tape out again which would take the best part of a year even if they could get TSMC to agree to produce the chip, by which point they'd have missed the market.
The fact that the article teases an industry going through change makes me think it's probably a company that produces things for 5G. My money would be on Nokia.
When a chip design is stable enough for manufacturing them. But chips usually have post si bugs and so the tape out is usually a back and forth process depending on how complex thechip is and how competent the design team was.
Tapeout refers to when the photomask is done, basically when you have completed the design, rendered it graphically and are ready to send to fabrication.
tldr this article is basically saying the 10nm is so screwed up they can't just adjust a few things, they need to fix a lot and the more changes you start having to make the more verification that needs to be done before things are signed off and ready for tapeout.
Comments
They sell the full article which is why they aren't naming it in the public article. I suspect what they're saying is that the company has invested so heavily in getting to tapeout on Intel that it's too late to move their design to TSMC. To do that they would basically have to tape out again which would take the best part of a year even if they could get TSMC to agree to produce the chip, by which point they'd have missed the market.
The fact that the article teases an industry going through change makes me think it's probably a company that produces things for 5G. My money would be on Nokia.
What is tape out?
https://en.wikipedia.org/wiki/Tape-out
When a chip design is stable enough for manufacturing them. But chips usually have post si bugs and so the tape out is usually a back and forth process depending on how complex thechip is and how competent the design team was.
Tapeout refers to when the photomask is done, basically when you have completed the design, rendered it graphically and are ready to send to fabrication.
tldr this article is basically saying the 10nm is so screwed up they can't just adjust a few things, they need to fix a lot and the more changes you start having to make the more verification that needs to be done before things are signed off and ready for tapeout.
When the plans are ready to send to the foundry.